Highly accelerated lifetime testing in power electronics

نویسندگان

چکیده

Abstract This paper presents case studies on application of accelerated mechanical fatigue testing for evaluation wire bond interconnects and interfaces in electronic devices. A dedicated experimental set-up is designed to induce failure the weak sites devices by reproducing modes occurring during operation. Acceleration achieved increasing frequency enabling determination lifetime curves a very short time. Exemplary degradation heavy bonds typically used power electronics are presented advantages some restrictions proposed method briefly discussed.

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ژورنال

عنوان ژورنال: Proceedings of the ... International Symposium on Microelectronics

سال: 2021

ISSN: ['1085-8024']

DOI: https://doi.org/10.4071/1085-8024-2021.1.000390